Bambu Pla Basic Refill (Spool Free)
6.300 د.ك
(the delivery will be in one week)
Accessory Compatibility
| Recommended | Not Recommended | |
|---|---|---|
| Build Plate | Cool Plate, High Temperature Plate or Textured PEI Plate | Engineering Plate |
| Hotend | All Size / Material | / |
| Glue | Bambu Liquid Glue Glue Stick |
/ |
| Recommended Printing Settings | |
| Drying Settings (Blast Drying Oven) | 55 °C，8 h |
| Printing and Keeping Container’s Humidity | < 20% RH (Sealed, with Desiccant) |
| Nozzle Temperature | 190 – 230 °C |
| Bed Temperature (with Glue) | 35 – 45 °C |
| Printing Speed | < 300 mm/s |
| Physical Properties | |
| Density | 1.24 g/cm³ |
| Vicat Softening Temperature | 57 °C |
| Heat Deflection Temperature | 57 °C |
| Melting Temperature | 160 °C |
| Melt Index | 42.4 ± 3.5 g/10 min |
| Mechanical Properties | |
| Tensile Strength | 35 ± 4 MPa |
| Breaking Elongation Rate | 12.2 ± 1.8 % |
| Bending Modulus | 2750 ± 160 MPa |
| Bending Strength | 76 ± 5 MPa |
| Impact Strength | 26.6 ± 2.8 kJ/m² |
| Color | Black, Pink, Silver, Yellow, Jade White, MISTLETOE GREEN |
|---|
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